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Module Socket

Model      

Pitch      

Pin count            

Body size(L x W X H)               

Socket Type                     


DDR2

1.0

240

152x13.8

152x17

141.9x7.5

141.9x7.5

SMT

DIP

M/B Insert

M/B DIP soldering

0.6

200

87.0x18.1

92x17

87x8.5

87x8.5

SMT

DIP

M/B Insert

M/B DIP soldering

 Insulation Resistance : >1,000㏁@500 VDC

Withstanding Voltage  : 700 VAC/1 minute

Contact Resistance : < 50 mΩ

OperatingTemperatureRange: Cantilever type :-10 ℃~ +120 ℃

Contact Force :5 kg·f  (Max7 kg·f )

Life Cycle : >100K cycle min . (1cycle = load & unload)

Boday:PEI

Contacts: BeCu

Plating: Ni+Au